Fabrication and Processing
Further information about specific instruments listed below may be obtained from the indicated MRSEC faculty contact.
Sputter deposition
- two-source system
- four-source system
- six-source system
- four-source large area (30 inch diameter substrate) system
Perkin-Elmer UHV deposition system (Chien).
PHI 430B molecular beam epitaxy (MBE) system (Chien).
Lambda-Physik pulsed laser deposition system
Irradiation chamber for nuclear particle tracks
Particle track etching facilities (Searson).
Multilayer electrochemical deposition system
Nanocomposite electrodeposition system (Searson).
Optical and electron beam lithography
Class 1000 Cleanroom
TSI 3025A scanning mobility particle sizer (Chien).
Tubular furnaces (up to 1500°C)
Lindberg/Blue tri-arc furnace
Spex 8000 high-energy ball mill (Chien).
Thermal evaporator
Wire bonder
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