Fabrication and Processing

Further information about specific instruments listed below may be obtained from the indicated MRSEC faculty contact.

Sputter deposition

  • two-source system
  • four-source system
  • six-source system
  • four-source large area (30 inch diameter substrate) system

Perkin-Elmer UHV deposition system (Chien).

PHI 430B molecular beam epitaxy (MBE) system (Chien).

Lambda-Physik pulsed laser deposition system

Irradiation chamber for nuclear particle tracks

Particle track etching facilities (Searson).

Multilayer electrochemical deposition system

Nanocomposite electrodeposition system (Searson).

Optical and electron beam lithography

Class 1000 Cleanroom

TSI 3025A scanning mobility particle sizer (Chien).

Tubular furnaces (up to 1500°C)

Lindberg/Blue tri-arc furnace

Spex 8000 high-energy ball mill (Chien).

Thermal evaporator

Wire bonder

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